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MS-98M3
MS-98M3
MS-98M3
MS-98M3
MS-98M3
MS-98M3

3.5" SBC with Intel® Tiger Lake-UP3 for Fanless, Ultra Low-Power, High-Performance & Wide Temperature Solution

  • Intel® 11th Gen Tiger Lake-UP3 Embedded/Industrial SKU Series
  • DDR4 3200 MHz SODIMM Slot up to 64GB
  • Quadruple independent displays: DP++ , HDMI™, 2 LVDS/eDP
  • 2 2.5GbE LAN with RJ-45
  • 1 M.2 B key (with NANO SIM-holder), 1 M.2 E key
  • 1 M.2 M key, 1 SATA 3.0 for storage
  • SATA RAID 0/1 (Supported by i7/i5 SKUs)
  • 4 USB 3.2 Gen 2, 4 USB 2.0, 4 COM (4 RS-485), DIO, Audio
  • Onboard TPM 2.0
  • Wide Voltage DC-IN 12~24V (OCP & OVP)
  • Wide operating temperature supported
  • Product Specifications
  • Ordering-Information
  • Packing-List
  • Optional-Items

Product Specifications

  • Part Number
  • Embedded SKUs
  • Industrial SKUs

Processor

  • CPU
  • 11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i7-1185G7E/i5-1145G7E, QC, 28W
    11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i3-1115G4E, DC, 28W
    11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Celeron® 6305E, DC, 15W
  • 11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i7-1185GRE/i5-1145GRE, QC, 28W
    11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i3-1115GRE, DC, 28W
  • Frequency
  • 1.5GHz~4.4GHz (Depends on CPU)
  • 1.5GHz~4.4GHz (Depends on CPU)
  • L2 Cache
  • 4MB~12MB (Depends on CPU)
  • 6MB~12MB (Depends on CPU)
  • CPU Type
  • BGA
  • BGA
  • BIOS
  • AMI
  • AMI

Memory

  • Technology
  • Dual-channel DDR4 3200MHz
  • Dual-channel DDR4 3200MHz
  • Max. Capacity
  • Up to 64GB
  • Up to 64GB
  • Socket
  • 2 x 260-pin SO-DIMMs
  • 2 x 260-pin SO-DIMMs

Display

  • Controller
  • Intel® Iris® Xe Graphics (For i7/i5 SKUs)
    Intel® UHD Graphics (For i3/Celeron SKUs)
  • Intel® Iris® Xe Graphics (For i7/i5 SKUs)
    Intel® UHD Graphics (For i3 SKU)
  • Graphic Memory
  • Depends on CPU
  • Depends on CPU
  • LVDS
  • 2 x Dual Channel 18/24-bit (Connector shared with eDP)
  • 2 x Dual Channel 18/24-bit (Connector shared with eDP)
  • eDP
  • 2 x eDP (Connector shared with LVDS)
  • 2 x eDP (Connector shared with LVDS)
  • HDMI
  • 1
  • 1
  • DisplayPort
  • 1
  • 1
  • Multiple Display
  • 4 independent displays
  • 4 independent displays
  • Display Interface
  • LVDS up to 1920 x 1200 @60 Hz
    eDP up to 4096 x 2160 @60 Hz
    HDMI™ up to 4096 x 2160 @30Hz
    DP up to 7680 x 4320 @60Hz
  • LVDS up to 1920 x 1200 @60 Hz
    eDP up to 4096 x 2160 @60 Hz
    HDMI™ up to 4096 x 2160 @30Hz
    DP up to 7680 x 4320 @60Hz

Ethernet

  • Controller
  • 2 x Intel® I225-LM 2.5 GbE LAN
  • 2 x Intel® I225-IT 2.5 GbE LAN
    (LAN Speed running at 1000/100/10Mbps when OP TEMP. over 70°C)

Audio

  • Controller
  • Realtek® ALC888-VD2-GR HD Audio Codec
  • Realtek® ALC888-VD2-GR HD Audio Codec

Super I/O

  • Controller
  • Fintek F81966AB-I
  • Fintek F81966AB-I

H/W Monitor

  • Watchdog Timer
  • 256-level Watchdog Timer
  • 256-level Watchdog Timer
  • Smart Fan
  • Yes
  • Yes

TPM

  • Controller
  • Infineon SLB9670VQ2.0
  • Infineon SLB9670XQ2.0

Expansion Slot

  • M.2
  • 1 x M.2 M key (PCIe Gen4 x4 NVMe), 2280
    1 x M.2 B key (SATA 3.0, PCIe x1, USB 2.0, w/NANO SIM-Holder), 2242/3042
    1 x M.2 E key (PCIe x1, USB 2.0), 2230
  • 1 x M.2 M key (PCIe Gen4 x4 NVMe), 2280
    1 x M.2 B key (SATA 3.0, PCIe x1, USB 2.0, w/NANO SIM-Holder), 2242/3042
    1 x M.2 E key (PCIe x1, USB 2.0), 2230

Storage

  • SATA
  • 1 x SATA 3.0
  • 1 x SATA 3.0

I/O Interface

  • USB
  • 4 x USB 2.0 (internal)
    4 x USB 3.2 Gen 2 (rear)
  • 4 x USB 2.0 (internal)
    4 x USB 3.2 Gen 2 (rear)
  • Serial
  • 4 x COM ports (internal)
    COM1~4: RS-232/422/485, 0V/5V/12V, support auto flow control
  • 4 x COM ports (internal)
    COM1~4: RS-232/422/485, 0V/5V/12V, support auto flow control
  • GPIO
  • 16-bits (8 x GPI; 8 x GPO), 5V
  • 16-bits (8 x GPI; 8 x GPO), 5V

Power Supply

  • DC Input
  • DC-in 12~24V (OCP & OVP)
  • DC-in 12~24V (OCP & OVP)

Environment

  • Operating Temperature
  • -10 ~ 60°C
    Note:
    1. Thermal w/ Airflow:0.7m/s
    2. The standard thermal solution only supports TDP up to 15W.
  • -40 ~ 70°C (w/Turbo disabled)
    Note:
    1. Thermal w/ Airflow:0.7m/s
    2. The standard thermal solution only supports TDP up to 15W.
    3. -40 ~ 85°C by request
  • Operating Humidity
  • 10 ~ 90%, non-condensing
  • 10 ~ 90%, non-condensing
  • Storage Humidity
  • 10 ~ 90%, non-condensing
  • 10 ~ 90%, non-condensing
  • Storage Temperature
  • -20 ~ 80°C
  • -40 ~ 85°C

Form Factor

  • Dimensions
  • 146 x 102 mm (3.5")
  • 146 x 102 mm (3.5")
  • Weight
  • 0.65 kg
  • 0.65 kg

Certification

  • EMC
  • FCC, CE, RCM, VCCI, BSMI, UKCA, IC
  • FCC, CE, RCM, VCCI, BSMI, UKCA, IC

Software Platform

  • OS Support
  • Windows 10 IoT Enterprise 2019 LTSC (64-bit, RS5)
    Windows 10 IoT Enterprise 2021 LTSC (64-bit, 21H2)
    Linux (Support by request)
  • Windows 10 IoT Enterprise 2019 LTSC (64-bit, RS5)
    Windows 10 IoT Enterprise 2021 LTSC (64-bit, 21H2)
    Linux (Support by request)

Ordering Information

  • Part Number
  • Description
  • 919-98M3-001
  • MS-98M3\609-98M3-010\809-98M3-014 VER 1.0 STD Intel Tiger Lake-UP3, i7-1185GRE,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,WT
  • 919-98M3-002
  • MS-98M3\609-98M3-020\809-98M3-015 VER 1.0 OPT:A Intel Tiger Lake-UP3,i5-1145GRE,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,WT
  • 919-98M3-003
  • MS-98M3\609-98M3-030\809-98M3-016 VER 1.0 OPT:B Intel Tiger Lake-UP3, i3-1115GRE,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,WT
  • 919-98M3-004
  • MS-98M3\609-98M3-040\809-98M3-017 VER 1.0 OPT:C Intel Tiger Lake-UP3, i7-1185G7E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT
  • 919-98M3-005
  • MS-98M3\609-98M3-050\809-98M3-018 VER 1.0 OPT:D Intel Tiger Lake-UP3, i5-1145G7E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT
  • 919-98M3-006
  • MS-98M3\609-98M3-060\809-98M3-019 VER 1.0 OPT:E Intel Tiger Lake-UP3, i3-1115G4E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT
  • 919-98M3-007
  • MS-98M3\609-98M3-070\809-98M3-020 VER 1.0 OPT:F Intel Tiger Lake-UP3, Celeron 6305E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT

Packing List

  • Part Number
  • Description
  • Quantity
  • K1G-3002057-V03
  • DC Power Cable, 200mm
  • 1
  • K14-3018001-V03
  • COM Port Cable, 150mm
  • 1
  • K1B-3008067-V03
  • USB Cable, 150mm
  • 1
  • K1D-3012023-V03
  • SATA Cable with Power, 230mm
  • 1

Optional Item

  • Part Number
  • Description
  • E31-0806800-K08
  • Heatspreader
The MSI MS-98M3 is a 3.5” Single Board Computer (SBC) designed for fanless, ultra low-power, high-performance applications, featuring the Intel® 11th Gen Tiger Lake-UP3 Embedded/Industrial SKU Series processors. It supports up to 64GB of DDR4 3200 MHz memory through a single SODIMM slot. The board supports quadruple independent displays via DP++, HDMI™, and two LVDS/eDP interfaces. Networking capabilities include two 2.5GbE LAN ports with RJ-45 connectors. Expansion options include one M.2 B key slot (with Nano SIM holder), one M.2 E key slot, and one M.2 M key slot. For storage, it provides one SATA 3.0 port and supports SATA RAID 0/1 (supported by i7/i5 SKUs). Connectivity options include four USB 3.2 Gen 2 ports, four USB 2.0 ports, four COM ports (all RS-485), DIO (Digital Input/Output), and audio. The board features onboard TPM 2.0 and supports a wide voltage DC-IN range of 12-24V with Over-Current Protection (OCP) and Over-Voltage Protection (OVP). It also supports a wide operating temperature range, making it suitable for demanding industrial environments.
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